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Domain Informations
Bondply.com lookup results from whois.godaddy.com server:
- Domain created: 2009-08-13T16:30:53Z
- Domain updated: 2023-06-07T17:09:38Z
- Domain expires: 2024-08-13T16:30:53Z 0 Years, 60 Days left
- Website age: 14 Years, 305 Days
- Registrar Domain ID: 1565510746_DOMAIN_COM-VRSN
- Registrar Url: http://www.godaddy.com
- Registrar WHOIS Server: whois.godaddy.com
- Registrar Abuse Contact Email: [email protected]
- Registrar Abuse Contact Phone: 480-624-2505
- Name server:
- NS1.MEDIATEMPLE.NET
- NS2.MEDIATEMPLE.NET
Network
- inetnum : 107.180.0.0 - 107.180.127.255
- name : GO-DADDY-COM-LLC
- handle : NET-107-180-0-0-1
- status : Direct Allocation
- created : 2007-06-01
- changed : 2023-12-19
- desc : Please send abuse complaints to [email protected],Please send abuse complaints to [email protected]
Owner
- organization : GoDaddy.com, LLC
- handle : GODAD
- address : Array,Tempe,AZ,85284,US
Abuse
- handle : ABUSE51-ARIN
- name : Abuse Department
- phone : +1-480-624-2505
- email : [email protected]
Technical support
- handle : NOC124-ARIN
- name : Network Operations Center
- phone : +1-480-505-8809
- email : [email protected]
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Host Informations
| Host name | 72.58.180.107.host.secureserver.net |
| IP address | 107.180.58.72 |
| Location | Scottsdale United States |
| Latitude | 33.6013 |
| Longitude | -111.8867 |
| Metro Code | 753 |
| Timezone | America/Phoenix |
| Postal | 85260 |
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We found Websites Listing below when search with bondply.com on Search Engine
Prepregs and Bondplys - Rogers Corporation
Prepregs and Bondplys. Rogers offers a wide arrangement of bonding and adhesion materials directly matched to complement our broad, industry-leading, high frequency circuit material offerings. Rogers' portfolio of prepregs and bondplys are designed for consistent reliability and performance for the most demanding multi-layer PWB applications.
Rogerscorp.comDA: 14 PA: 50 MOZ Rank: 67
bondply | Microwave Journal
Microwave Journal Content on 'bondply' Rogers Corp. will be exhibiting several of its high-performance circuit materials at the upcoming electronica 2012 trade show.Scheduled for November 13-16, 2012 at the New Munich Trade Fair Centre, Munich, Germany, the 25th international electronica trade show (www.electronica.de) is a major electronics event for a …
Microwavejournal.comDA: 24 PA: 17 MOZ Rank: 42
Pyralux® LF Copper Clad Laminates, Coverlays, Bondply …
Pyralux® LF Copper Clad Laminate, Coverlay, Bondply & Sheet Adhesive. DuPont™ Pyralux® LF products are acrylic-based copper clad laminates, coverlays, bondplys and sheet adhesives and have been the industry standard in high reliability applications for over 35 years with a proven record of consistency and dependability.
Dupont.comDA: 14 PA: 25 MOZ Rank: 41
Rogers Corporation Introduces RO4460G2™ Bondply
The introduction of RO4460G2 bondply now provides designers a 0.004” (0.101 mm) bonding layer that complements the already released RO4360G2™ low loss, glass-reinforced 6.15 Dk copper clad . . . Rogers Corporation is pleased to introduce RO4460G2, low loss bondply with a 6.15 dielectric constant (Dk). RO4000® thermoset high performance …
Signalintegrityjournal.comDA: 30 PA: 50 MOZ Rank: 93
Real Bond
About The Company. ‘REAL BOND’ PLYWOOD is well known name in plywood trade. The organization is focused in marketing of wide range of panel products. The directors of the company have been serving this trade since last 25 years. The Company insists on honesty, integrity and fairness in all aspects of its business and expects the same in its ...
Realbondply.comDA: 15 PA: 15 MOZ Rank: 20
Bond-Ply® 800 Series - Bergquist - Pads, Sheets | Online Catalog ...
Bond-Ply® 800 is a thermally conductive, electrically isolating double-sided tape. Bond-Ply® 800 is utilized in lighting applications that require thermal transfer and electric isolation. High bond strengths obtained at ambient temperature lead to significant processing cost savings in labor, materials and throughput due to the elimination of ...
Digikey.comDA: 15 PA: 47 MOZ Rank: 67
Bergquist Company Bond-Ply Thermal Interface Products
Bergquist Company Bond-Ply Thermal Interface Products are available at Mouser Electronics. Mouser offers inventory, pricing, & datasheets for Bergquist Company Bond …
Mouser.caDA: 13 PA: 49 MOZ Rank: 68
RO4400-RO4450B-RO4450F-RO4450T-RO4460G2 Series Bondply …
Bondply are still commonly used to inexpensively form less critical signal layers. The RO4400™ bondply family is comprised of four grades based on the RO4000 series core materials, and are compatible in multi-layer constructions with RO4000 laminates. A high postcure Tg makes RO4400 series bondply an excellent choice for multi-layers
Wellerpcb.comDA: 13 PA: 50 MOZ Rank: 76
Pyralux® FR Copper Clad Laminate, Coverlay, Bondply & Sheet …
Construction and Certification for Coverlay and Bondply: Polyimide thickness: 12, 25, 50, 75 and 125um; Adhesive thickness: 12, 25, 50 and 75um; Certified to IPC 4203A/1 . Pyralux® FR Sheet Adhesive. DuPont™ Pyralux® FR sheet adhesive is a proprietary B-staged modified acrylic adhesive coated on release paper. Sheet adhesive is used primarily to bond flexible …
Dupont.comDA: 14 PA: 25 MOZ Rank: 47
Our Products – Real Bond
Gold. GOLD is manufactured by using selelcted premium hardwood logs. All the logs are kept in preservative mixed water tank for a fixed period before sending it for peeling. Resin used is manufactured as per the guidelines provided by BIS.
Realbondply.comDA: 15 PA: 14 MOZ Rank: 38
Rogers RO4400 /RO4400T Series Bondply Configuration and
Manufacturers design RO4400 dielectric materials in Rogers RO4400 and RO4400T series RF connectors. These dielectric materials are low-loss and resistive-type data cables. Additionally, they have an excellent shielding performance offered in wide lengths and configurations to meet almost any application. As a result, the low-loss dielectric material minimizes the amount of …
Raypcb.comDA: 14 PA: 27 MOZ Rank: 51
Bond-Ply 100
Bond-Ply®100 Thermally Conductive, Pressure Sensitive Adhesive Tape Typical Properties of Bond-Ply 100 Property Imperial Value Metric Value Test Method
Rico-inc.comDA: 12 PA: 37 MOZ Rank: 60
DE112016005389T5 - BONDPLY MATERIALS AND CIRCUIT …
A composition for a bondply and a circuit subassembly comprising such a bondply are disclosed. The circuit subassembly may have a UL-94 rating of V-0. The composition of the bondply layer comprises 25 to 45 volume percent liquid resin; 10 to 40 weight percent of a bromine-containing or phosphorus-containing aromatic compound having a maximum melting …
Patents.google.comDA: 18 PA: 27 MOZ Rank: 57
Low-loss bondply material for high-frequency circuit boards
Rogers Corporation introduces the RO4460G2, a low-loss bondply with a 6.15 dielectric constant (Dk). RO4000® thermoset high performance bonding layers have long been used by circuit designers for multilayer board constructions using Rogers high frequency and high speed digital materials where operating frequency, dielectric constant, or high-speed signal …
Analogictips.comDA: 20 PA: 50 MOZ Rank: 94
Bondply Data Sheet: R04400 Series | 2018-01-16 | Microwave Journal
The RO4400™ bondply family is comprised of three grades based on the RO4000 series core materials, and are compatible in multi-layer constructions with RO4003C, RO4350B, RO4360G2, RO4835 or RO4000 LoPro laminates. A high postcure Tg makes RO4400 series bondply an excellent choice for multi-layers requiring sequential laminations as fully cured …
Microwavejournal.comDA: 24 PA: 48 MOZ Rank: 86
Low loss bondply delivers 6.15 dielectric constant
ROGERS RO4460G2 low loss bondply with a 6.15 dielectric constant (Dk) provides a 0.004” (0.101 mm) bonding layer that complements firm’s RO4360G2 low
Ept.caDA: 10 PA: 50 MOZ Rank: 86
How to Design a Hybrid PCB Stackup | Blog | Altium Designer
Allow Room for Bondply. Your fabricator can give you some insight into the thickness variation you can expect to see in the finished board once bondply is added. Make sure to consider this when planning the stackup. You generally do not need to worry about the dielectric constant of the bondply layer unless you need to route over it. If you ...
Resources.altium.comDA: 20 PA: 32 MOZ Rank: 68
LF0111 - DuPont | PCB Laminates
LF0111 - PCB Laminates from DuPont. Get product specifications, Download the Datasheet, Request a Quote and get pricing for LF0111 on PCB-Directory
Pcbdirectory.comDA: 20 PA: 50 MOZ Rank: 90
Bond-Ply 100 - Digi-Key
Bond-Ply®100 Thermally Conductive, Pressure Sensitive Adhesive Tape Typical Properties of Bond-Ply 100 Property Imperial Value Metric Value Test Method
Media.digikey.comDA: 17 PA: 50 MOZ Rank: 92
Prepreg vs. Core: What Are Their Role in PCB Manufacturing
Prepreg vs. Core, also known as before lamination, is the PCB’s insulating material. Designers primarily use prepreg as a bonding material. Not only that, but they also use it as an insulating material for the multilayer PCB inner conductive pattern. As a result, after the user has laminated the prepreg and extruded the semi-cured epoxy, it will solidify and it flows, binding the …
Ourpcb.comDA: 14 PA: 21 MOZ Rank: 54
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